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February 14, 2000

Sheldahl Expands ComClad High-Frequency Circuit Board Laminate Line with New Large Panels for Powerful Antenna Applications

Press Release Index

 

New panel sizes of up to 24" x 110" address next-generation cellular market, wireless LANs

 

NORTHFIELD, MN (February 14, 2000) — Sheldahl, Inc., (Nasdaq: SHEL) this month introduces new large-format panels for ComClad HF, its proprietary family of high-frequency laminates for circuits used in wireless communications. Designed primarily to meet the mounting demand for next-generation cellular antennas and wireless systems, the new panel sizes of up to 24" x 110" can also be used in wireless local loop, microstrip antennas, array antennas and a variety of other high-frequency wireless applications.

The addition of large panels to the ComClad HF line makes Sheldahl one of the few suppliers able to deliver high-frequency circuit board laminate in large format. The 24" x 110" panels will be stocked in .030- and .060-inch thicknesses. Other sizes and thicknesses can be customized on request.

"With the widely publicized transformation of cellular phones into devices that retrieve e-mail or check stock quotes, the need for wireless Internet access is growing rapidly. At the same time, the wireless LAN/WAN market is also taking off," said Randy Lia, Product Manager for the ComClad HF line. "High-frequency antennas are required to deliver the bandwidth for these and other emerging wireless applications, and our new large-format ComClad panels will help the industry meet those needs."

Introduced last year, ComClad HF builds on Sheldahl’s decades of experience as a leading provider of high performance materials and flexible printed circuit boards. ComClad is the only product of its kind to utilize Noryl® plastic material as the base dielectric, producing a high-performance product at an extremely competitive price.

ComClad features a dielectric constant of 2.6, loss tangent of .0025, and a completely homogeneous Noryl plastic dielectric. The product is available in standard circuit board panel sizes of 12" x 18" and 18" x 24" as well as the new large format, with a variety of standard dielectric thicknesses and copper cladding.

The ComClad HF family of products is designed for the microwave and radio-frequency (RF) segments of the wireless market, including base stations, satellite communications, PCS antennas, two-way pagers, direct broadcast antennas, microstrip and array antennas for various other applications, wireless LANs and automotive collision avoidance radar.

Sheldahl will be exhibiting ComClad in Booth 1708 at the "Wireless Symposium – Portable by Design" that opens in San Jose next Tuesday, February 22.

About Sheldahl, Inc.

Sheldahl, Inc. is a leading producer of high-density substrates, high-quality flexible printed circuitry, and flexible laminates primarily for sale to the automotive electronics and data communications markets. The company, which is headquartered in Northfield, Minnesota, has operations in Northfield; Longmont, Colorado; Detroit, Michigan; Britton, South Dakota; Toronto, Ontario, Canada; and Chihuahua, Chihuahua, Mexico. Its sales offices are located in Hong Kong, China; Singapore; U.K.; France; and Germany. Sheldahl’s common stock trades on the Nasdaq National Market tier of the Nasdaq Stock Market under the symbol: SHEL.

For more information, contact Melissa Stoltz, S&S Public Relations at 847/955-0700 ext. 250 (stoltz@sspr.com), or Randy Lia, Sheldahl, Inc. at 507/663-8477 (randy.lia@sheldahl.com) or see Sheldahl’s web site at www.sheldahl.com

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