ComClad HF high-frequency circuit material consists of Noryl® plastic material as the base dielectric and has excellent electrical performance for use in microwave and RF applications. ComClad HF laminate is especially attractive because of the combination of a dielectric constant of 2.6, a dissipation factor of .0025 and very low prices.

Because ComClad HF laminates use a common plastic as the base dielectric, designers and fabricators can form, mold, bend, and even insert-mold it in a plastic injection process.

ComClad HF laminate is available in standard circuit board panel sizes of 12" x 18" and 18" x 24" with a variety of standard dielectric thicknesses and copper cladding. Sheldahl's flexible manufacturing also allows for custom designs of panel size, thickness and copper clad. The material processes through standard printed circuit board manufacturing operations.

It is rated at continuous operating temperatures of -40°C - +85°C and can be SMT or through hole soldered with shielding fixtures to prevent direct heat contact to the material.

Applications for ComClad HF laminates include cellular and PCS base stations, direct broadcast antennas, wireless LANs, antennas for various applications, automotive collision avoidance radar and three dimensional circuit boards.

For more information on Sheldahl's ComClad product design and performance features refer to the information below: