Novaclad® - adhesiveless flexible laminate technology.  Sheldahl's Novaclad laminate offers a family of adhesiveless copperclad polyimide film laminate uniquely created to meet difficult design challenges. It features thin copper, thermal and chemical resistance, fine-line fabrication, high frequency performance capability and proven reliability. 

The Novaclad laminate is made through a patented process which allows for direct deposition of flexible ductile copper onto both sides of a high performance film.    With no adhesive, Novaclad laminates provide excellent processability, as well as advantages in achieving high circuitry density, stability, thickness, and chemical resistance.  Novaclad laminate applications vary from packaging multichip modules, silicon chips, engine control module circuitry, sensors, to antennas.

Sheldahl's Novaclad G2300 grade laminate provides proven flexibility and physical strength.  Its very fine feature capability and excellent high frequency signal propagation is only available from an adhesiveless laminate. 

Datasheet #	Description	Download PDF
G2300	Novaclad G2300	PDF
PB231	Novaclad Etching	PDF