Sheldahl's PENClad material provides a truly flexible copper-PEN Laminate able to withstand the high temperatures associated with circuit assembly without compromising performance.  The PENClad laminate gives you effective solderability at a reduced cost by bridging the gap that exists between low cost flexibility and surface mounted components.  It offers significant benefits for mass produced products such as mobile communications, automotive modular interconnect, flex jumpers and battery circuits. 

PENClad laminates feature Sheldahl materials, providing low cost assembly for high density flex circuits:

• Enhanced assembly process window
• Operating temperature between Polyimide and PET
• Eliminates pre-dry to minimize production time and cost
• Low moisture absorption
• Low cost

For more information on Sheldahl's PENClad material design and performance features refer to the information below: