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Product Bulletin - 243
Double Layer - Flexible Circuit Interconnect
 

Layers

  • 2-layer

Base Material

  • Polyimide - 50µ (.002") flame retardant (FR) or non-flame retardant polyester epoxy adhesive
  • Polyester - 75µ (.003") or 125µ (.005") FR or non-FR polyester epoxy adhesive
  • PEN - 50µ (.002") non-FR polyester epoxy adhesive

Copper

  • 1 oz/ft2 - 35µ (.0014") Base copper: 2 oz/ft2 - 70µ (.0028") Finished thickness
  • 2 oz/ft2 - 70µ (.0028") Base copper: 3 oz/ft2 - 105µ (.0042") Finished thickness

Soldermask/Dielectric

  • Screen Printed Ink
  • Photoimaged coverlay
  • Polyimide film - 25µ (.001")
  • Polyester film – 75µ (.003")

Surface Finish

  • Antitarnish
  • Shelcoat® - OSP - organic solderability preservative
  • Tin/lead - electroplated
  • Tin/lead - Hot air solder leveled (HASL)
  • Nickel/Gold – electroplated

Conductor Width and Space

  • 2 oz/ft2 - 70µ (.0028") Finished thickness - .305mm (.012") minimum
  • 3 oz/ft2 - 105µ (.0042") Finished thickness - .500mm (.020") minimum

Soldermask/Dielectric Definition

  • See Sheldahl Standard Flexible Circuit Design Guideline

Via Holes/Pad Size

  • .50mm (.016") finished hole size minimum {.46mm (.018") punched hole size}.
  • 1.4mm (.054") pad size minimum or oversized from punched hole by .018" per side

Design Capability

  • Sheldahl has a extensive design capability. Design data and net lists can be input and output in a wide variety of standard industry formats

Prototype Capability

  • Sheldahl has a fully staffed prototype facility that will provide prototypes in 2-3 weeks

 
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