Layers

• 1-layer

Base Material

• Polyimide - 50µ (.002") flame retardant (FR) or non-flame retardant polyester epoxy adhesive
• Polyester - 75µ (.003") or 125u (.005") FR or non-FR polyester epoxy adhesive
• PEN - 50µ (.002") non-FR polyester epoxy adhesive

Base Copper

• 1 oz/ft² - 35µ (.0014")
• 2 oz/ft² - 70µ (.0028")
• 3 oz/ft² - 105µ (.0042")
• 4 oz/ft² -140µ (.0056")

Soldermask/Dielectric

• Screen Printed Ink
• Photoimaged coverlay
• Polyimide film - 25µ (.001")
• Polyester film – 75µ (.003")

Surface Finish

• Antitarnish
• Shelcoat^® - OSP - organic solderability preservative
• Tin/lead - electroplated
• Tin/lead - Hot air solder leveled (HASL)
• Nickel/Gold - electroplated

Conductor Width and Space

• 1 oz/ft² - 35µ (.0014") - .254 mm (.010") minimum
• 2 oz/ft² - 70µ (.0028") - .305 mm (.012") minimum
• 3 oz/ft² - 105µ (.0042") - .500 mm (.020") minimum

• 4 oz/ft² -140µ (.0056") – 1.0 mm (.040") minimum

Soldermask/Dielectric Definition

• See Sheldahl Standard Flexible Circuit Design Guideline

Design Capability

• Sheldahl has a extensive design capability. Design data and net lists can be input and output in a wide variety of standard industry formats

Prototype Capability

• Sheldahl has a fully staffed prototype facility that will provide prototypes in 1-3 weeks

 

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