Layers

• 1 or 2-layer

Base Material

• Novaclad^® adhesiveless laminate - 50µ (.002") polyimide

Copper

• 1/8 oz/ft² - 5µ (.00018") Base copper: ½ oz/ft² - 15µ (.0007") finished thickness
• 1/8 oz/ft² - 5µ (.00018") Base copper: 1 oz/ft² - 35µ (.0014") finished thickness

Soldermask/Dielectric

• Photoimageable coverlay
• Screen printed polyimide ink
• Polyimide film 25µ (.001")

Surface Finish

• Antitarnish
• Shelcoat^® - OSP - organic solderability preservative
• Tin/lead - electroplated
• Tin/lead – Hot air solder leveled (HASL)
• Nickel/Gold - electroplated

Conductor Width and Space

• ½ oz/ft² - 15µ (.0007") finished thickness - 125µ (.005") minimum
• 1 oz/ft² - 35µ (.0014") finished thickness - 178µ (.007") minimum

Soldermask/Dielectric Definition

• See Sheldahl Novaflex™ HD Flexible Circuit Design Guideline

Via Holes/Pad Sizes

• .381mm (.015") finished hole size minimum (.431mm (.017") punched hole size)
• 1.04mm (.041") minimum pad size or oversized from hole by .305mm (.012") per side

Design Capability

• Sheldahl has an extensive design capability. Design data and net lists can be input and output in a wide variety of standard industry formats

Prototype Capability

• Sheldahl has a fully staffed prototype facility that will provide prototypes in 2-3 weeks

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