• History

Corporate Overview and History

Corporate Overview

Sheldahl Inc. was purchased by Multek in 2004. Multek develops, manufactures and sells Sheldahl® brand materials. Multek is one of the top 10 global suppliers of rigid and flexible printed circuits. With over 30 years of printed circuit board manufacturing experience Multek offers industry-leading interconnect solutions, including Rigid, Flexible and Rigid-Flex printed circuit boards for a broad range of applications.



  • 1955

    Sheldahl was established as G.T. Schjeldahl Company by Gilmore T. “Shelly” Schjeldahl. The newly formed company produced bag-making machines. image1

    G.T. Schjeldahl
  • 1960

    ECHO I the 100-foot passive satellite (“satelloon”) that was produced by Schjeldahl was launched.

    Company constructs a 540-foot long air-supported building which came to be known as the “Schjel-mile”


    ECHO -1
  • 1961

    ECHO II is fabricated using Schjeldahl materials.

  • 1963

    Production of “Schjel-Flex”, a line of precision-etched flexible circuitry processed in roll-to-roll form using “Schjel-Clad” materials.

  • 1964

    The satellite Pegasus was sent to orbit. The meteoroid detector panels were fabricated by Schjeldahl through vacuum deposition and lamination.

    aerospace & Defense
  • 1965

    Pageos 5 a 100-ft diameter satelloon produced with Schjeldahl materials was launched. 

    Schjeldahl participated in the Voyager program.

  • 1971

    Schjeldahl’s flexible circuits were used by Western Electric to produce the Trimline telephone.

  • 1973

    Schjeldahl provides thermal control materials in response to an emergency repair needed on the Skylab. 

  • 1974

    The company’s name was changed to Sheldahl, Inc. to make it easier to spell and pronounce the company name.

    comapny name


  • 1975

    The Viking unmanned spacecraft landed on Mars.The bioshield that kept the spacecraft sterile during its journey was built by Sheldahl and included the signatures of the Sheldahl employees that produced it.

  • 1977

    FLEXSWITCH®, a new line of membrane switches was introduced for use in office equipment and appliances.

    1977 Sheldahl
  • 1980

    Sheldahl patents unidirectional tape. A splicing system for the joining the butt ends to abrasive materials.

    abrasive materials.
  • 1984

    Sheldahl acquires Symbolic Displays Inc. of Irvine, CA to increase the scope and depth of our capabilities.

  • 1987

    .Sheldahl acquired Cirtel / Cirpak of Irvine, CA and Nashua Flexible Circuits of Nashua, NH from BMC’s Interconics.

  • 1989

    Sheldahl introduced Z-Link® an inter-connective circuitry system based on an adhesive that conducts electricity only in the Z (vertical) axis.

    Z link
  • 1990

    Novaclad® a copper on film flexible material was introduced. The Novaclad® was produced by vapor depositing copper directly onto the surface of a polyimide film and then additional copper is plated to the desired thickness.

    flexible material
  • 1993

    Novalink® a multilayer circuit constructed with Novaclad® or Novaflex® and Z-Link® adhesive was introduced to the market.

  • 1994

    ViaGrid® was developed. A Novaclad® based microcircuit substrate with a pattern of either uniform or custom placed conductive holes.

  • 2000

    Sheldahl introduced a family of ITO films to the market under the trademark: ACCENTIA® 

    Sheldahl introduced ComClad™ HF a family of high-frequency laminates designed for use in the wireless communications market.

  • 2001

    Sheldahl provided the world’s first roll-to-roll of patterned ITO material for the display market.

  • 2004

    Sheldahl is purchased by Multek

  • 2007

    Sheldahl high volume roll-to-roll ITO patterning and screen printing capability is established

  • 2012

    Bus Bond® a family of insulation materials used as inner and outer layers in the production of laminated busbars is introduced to the market.

    Roll-to-Roll “PEDOT” (Poly(3,4-ethylenedioxythiophene)) screening printing offered to the marketplace.

    Bus Bond
  • 2015

    Q-Prime: A proprietary circuit technology with thermally conductive adhesive and a thin composite structure. 

    Q Prime