Flexible Circuits

Flexible printed circuits offer a broad array of physical and electrical interconnect solutions that cannot be achieved with rigid printed circuit board solutions. With 60+ years of mass production experience, Sheldahl® is an industry leader in materials conversion, fabrication, & flexible printed circuits assembly.

We are vertically integrated; from material development and production, circuit fabrication to final component assembly. Sheldahl® combines diverse materials to deliver interconnect and material solutions. Examples are: Sheldahl’s signature Novaclad®, Polyimide, PET, PEN and Liquid Crystal Polymer(LCP) substrate materials. We are able to rapidly customize laminate, cover film, and covercoat materials to meet your requirements.

To learn more about our flex circuit capabilities request to have Sheldahl® contact you directly or contact us by emailing info@sheldahl.com or calling our US toll free number 866-702-0329.

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Flexbase® - Single & Double Sided Circuits

High volume products that leverage automation and our broad electronic material offering; engineered adhesives, options of dielectric and conductor type.

Capabilities

PET, PEN, PI + film substrates 
Functional Adhesives – Flame Retardant, non-Flame Retardant, Thermally conductive, formable, authenticatable.
Screen defined circuitry
Screened Dielectric
Hybrid technology
Roll-to-roll manufacturing, including surface finish

Sheet processing and Circuit Finishing

Cover film/Stiffener Lamination
Shielding Film Application
Screened Shields (Silver)
Electrical Testing
Circuit Blanking
Stiffeners
Folding
Soldering
Crimping
Amp staking
SMT assembly

Copper Surface Finishes

Surface Finishes including:
Electrolytic Tin/Lead
Electroplated Nickel/Gold
Electroless Nickel Immersion Gold (ENIG)
Electroplated Tin
Immersion Silver (ImAg)

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Novaclad™ HDI

Novaclad® HDI is built upon the rock of our proprietary adhesiveless laminate that leverages vacuum deposition, additive copper processes, and photolithography to enable fine line circuitry coupled with laser-drilled micro-vias. Novaclad HDI circuitry withstands the toughest conditions in terms of temperature and chemical exposure, and vibrational resistance. The dialable copper thickness provides an added degree of freedom in the design of miniaturized circuitry.

Capabilities

PI film ½ mil to 5-mil substrates 
Additive copper
SAP and mSAP
Laser via Plated Through Holes (PTH)
Photo-Imaged fine line circuitry
Laser Direct Imaging (LDI) for cover coat
Roll-to-Roll manufacturing

Sheet processing and Circuit Finishing

Cover film/Stiffener Lamination
Shielding Film Application
Screened Shielding (Silver)
Electrical Testing
Circuit Blanking
Stiffeners
Folding
Soldering
Crimping
Amp staking
SMT assembly

Copper Surface Finishes Copper

Surface Finishes including:
Electrolytic Tin/Lead
Electroplated Nickel/Gold
Electroless Nickel Immersion Gold (ENIG)
Electroplated Tin
Immersion Silver (ImAg)

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Q Prime® – Solutions in Thermal Management

Our thermal management platform offers flexible solutions that push the envelope by reducing thermal impedance by using innovative material composites. This helps improve thermal management in battery packs, high power LEDs, and addresses CTE mismatch issues in assemblies leading to longer product life.

Capabilities

Q-Prime Adhesive
Q-Prime® 1300
Q-Prime® 2900
Novaclad Q-P® 1300
PET, PEN or PI film substrates 
Screen defined circuitry
Screened Dielectric

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Transparent Circuits – Patterned ITO

The Sheldahl patterning process provides customizable solutions for projective capacitive touch sensors for Human Machine Interface, Displays, Heaters, and Shielding. We will build the materials to meet your design goals and process it into your desired format.

This includes screen printing additional circuitry features such as silver ink traces, carbon connection pads, resistors, and insulating overcoats. Stiffeners, overlays, and graphics can be added at your request.

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