Flexible Circuits

Flexible printed circuits offer a broad array of physical and electrical interconnect solutions that cannot be achieved with rigid printed circuit board solutions. With 60+ years of mass production experience, Sheldahl® is an industry leader in materials conversion, fabrication, & flexible printed circuits assembly.

We are vertically integrated; from material development and production, circuit fabrication to final component assembly. Sheldahl® combines diverse materials to deliver interconnect and material solutions. Examples are: Sheldahl’s signature Novaclad®, Polyimide, PET, PEN and Liquid Crystal Polymer(LCP) substrate materials. We are able to rapidly customize laminate, cover film, and covercoat materials to meet your requirements.

To learn more about our flex circuit capabilities request to have Sheldahl® contact you directly or contact us by emailing info@sheldahl.com or calling our US toll free number 866-702-0329.

 

Flexbase® - Single & Double Sided Circuits
Flexible
Double-sided circuits - Automobile dashboard
flexible
Single-sided Circuit - Printer Applications
Single & Double-sided Circuitry
Single-sided circuit - Amp/Speaker Application

High volume products that leverage automation and our broad electronic material offering; engineered adhesives, options of dielectric and conductor type.

Capabilities

  • PET, PEN, PI + film substrates 
  • Functional Adhesives – Flame Retardant, non-Flame Retardant, Thermally conductive, formable, authenticatable.
  • Screen defined circuitry
  • Screened Dielectric
  • Hybrid technology
  • Roll-to-roll manufacturing, including surface finish

 

Sheet processing and Circuit Finishing

  • Cover film/Stiffener Lamination
  • Shielding Film Application
  • Screened Shields (Silver)
  • Electrical Testing
  • Circuit Blanking
  • Stiffeners
  • Folding
  • Soldering
  • Crimping 
  • Amp staking
  • SMT assembly

Copper Surface Finishes

  • Surface Finishes including:
  • Electrolytic Tin/Lead
  • Electroplated Nickel/Gold
  • Electroless Nickel Immersion Gold (ENIG)
  •  Electroplated Tin
  •  Immersion Silver (ImAg)

 

Novaclad™ HDI
nova
Novaclad HDI - Snow Goggle Applications
Novaclad
HDI Application - Automotive
Novaclad HDI Processing
Novaclad HDI Applications
High Density Interconnect - Novaclad
Novaclad® HDI is built upon the rock of our proprietary adhesiveless laminate that leverages vacuum deposition, additive copper processes, and photolithography to enable fine line circuitry coupled with laser-drilled micro-vias.  Novaclad HDI circuitry withstands the toughest conditions in terms of temperature and chemical exposure, and vibrational resistance. The dialable copper thickness provides an added degree of freedom in the design of miniaturized circuitry.
 

Capabilities

  • PI film ½ mil to 5-mil substrates 
  • Additive copper
  • SAP and mSAP
  • Laser via Plated Through Holes (PTH)
  • Photo-Imaged fine line circuitry
  • Laser Direct Imaging (LDI) for cover coat
  • Roll-to-Roll manufacturing 

 

Sheet processing and Circuit Finishing

  • Cover film/Stiffener Lamination
  • Shielding Film Application
  • Screened Shielding (Silver)
  • Electrical Testing
  • Circuit Blanking
  • Stiffeners
  • Folding
  • Soldering
  • Crimping
  • Amp staking
  • SMT assembly

Copper Surface Finishes Copper

  • Surface Finishes including:
  • Electrolytic Tin/Lead
  • Electroplated Nickel/Gold
  • Electroless Nickel Immersion Gold (ENIG)
  • Electroplated Tin
  • Immersion Silver (ImAg)

 

Q Prime® – Solutions in Thermal Management
Q-Prime - Thermal Management Poster
Our thermal management platform offers flexible solutions that push the envelope by reducing thermal impedance by using innovative material composites. This helps improve thermal management in battery packs, high power LEDs, and addresses CTE mismatch issues in assemblies leading to longer product life.

Capabilities

  • Q-Prime Adhesive 
  • Q-Prime® 1300
  • Q-Prime® 2900
  • Novaclad Q-P® 1300 
  • PET, PEN or PI film substrates 
  • Screen defined circuitry
  • Screened Dielectric
     
Transparent Circuits – Patterned ITO
Transparent Circuits - ITO Application - Smart Mirrors
ITO Circuitry - Transparent Circuits
Heads up Display - ITO Application

The Sheldahl patterning process provides customizable solutions for projective capacitive touch sensors for Human Machine Interface, Displays, Heaters, and Shielding. We will build the materials to meet your design goals and process it into your desired format.

This includes screen printing additional circuitry features such as silver ink traces, carbon connection pads, resistors, and insulating overcoats. Stiffeners, overlays, and graphics can be added at your request.